Cal Poly Students Place Second in International Microelectronics Competition

SAN LUIS OBISPO – A multi-disciplinary team of Cal Poly students took second place in the Student Chapter Booth Competition at the 40th Annual International Symposium on Microelectronics in San Jose. This was the first year in which Cal Poly’s International Microelectronics and Packaging Society chapter participated in the event, the largest symposium related to microelectronics packaging industry in the world.

“We are very glad to have received second place, considering that it was our first time participating,” said Dr. Jianbiao (John) Pan, industrial and manufacturing engineering professor and IMAPS faculty advisor. “The award greatly increases the visibility of Cal Poly’s research and instruction in microelectronics packaging.”

The team was led by Daniel Marrujo, materials engineering graduate student and Cal Poly IMAPS president, and Andrew Farris, a graduate student in electrical engineering. The group presented the various research projects currently underway at Cal Poly.

“Our purpose was to increase visibility of microelectronics research at Cal Poly and keep the industry involved,” said Farris. Other students assisted with the booth, including materials engineering students Nic Vickers, Brian Wright, and Brian Stahl.

The Cal Poly display merged engineering research from several backgrounds, including electrical engineering, materials engineering, and computer engineering.

The students also enjoyed networking with likeminded professionals. “The most important experience I gained from this conference was the ability to network with engineers who have the same interests as I do,” said Marrujo. “Throughout college you meet a lot of students who are taking the same classes as you, but it is rare to find students who want to specialize in the same topics.”

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